Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers.
The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques.
The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included.
This title is in stock with our Australian supplier and should arrive at our Sydney warehouse within 1-2 weeks of you placing an order.
Once received into our warehouse we will despatch it to you with a Shipping Notification which includes online tracking.
Please check the estimated delivery times below for your region, for after your order is despatched from our warehouse:
ACT Metro 2 working days
NSW Metro 2 working days
NSW Rural 2-3 working days
NSW Remote 2-5 working days
NT Metro 3-6 working days
NT Remote 4-10 working days
QLD Metro 2-4 working days
QLD Rural 2-5 working days
QLD Remote 2-7 working days
SA Metro 2-5 working days
SA Rural 3-6 working days
SA Remote 3-7 working days
TAS Metro 3-6 working days
TAS Rural 3-6 working days
VIC Metro 2-3 working days
VIC Rural 2-4 working days
VIC Remote 2-5 working days
WA Metro 3-6 working days
WA Rural 4-8 working days
WA Remote 4-12 working days
Share This Book: