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Failure of Electronic Packaging

Failure of Electronic Packaging

Effects of Temperature, Moisture, Mechanical and Electrical Driving Forces

by K. W. SeahE-H Wong and Y. -W. Mai
Hardback
Publication Date: 01/06/2015
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Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers.

The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques.

The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included.

  • Discusses how the reliability of packaging components is a prime concern to electronics manufacturers
  • Presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques
  • Includes program files and macros for additional study
ISBN:
9781845695286
9781845695286
Category:
Technology: general issues
Format:
Hardback
Publication Date:
01-06-2015
Language:
English
Publisher:
Elsevier Science & Technology
Country of origin:
United Kingdom
Dimensions (mm):
228.6x152.4mm

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