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Lead Free Solder

Lead Free Solder

Mechanics and Reliability

by John Hock Lye Pang
Paperback
Publication Date: 30/10/2014
  $207.36
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Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global semiconductor packaging and electronics manufacturing industry. Electronic products such as smart phones, notebooks and high performance computers rely on lead-free solder joints to connect IC chip components to printed circuit boards. Lead Free Solder: Mechanics and Reliability provides in-depth design knowledge on lead-free solder elastic-plastic-creep and strain-rate dependent deformation behavior and its application in failure assessment of solder joint reliability. It includes coverage of advanced mechanics of materials theory and experiments, mechanical properties of solder and solder joint specimens, constitutive models for solder deformation behavior; numerical modeling and simulation of solder joint failure subject to thermal cycling, mechanical bending fatigue, vibration fatigue and board-level drop impact tests.
ISBN:
9781489991164
9781489991164
Category:
Electronics engineering
Format:
Paperback
Publication Date:
30-10-2014
Publisher:
Springer-Verlag New York Inc.
Country of origin:
United States
Pages:
175
Dimensions (mm):
235x155x10mm
Weight:
0.3kg

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