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Materials for High-Density Electronic Packaging and Interconnection

Materials for High-Density Electronic Packaging and Interconnection

by Committee on Materials for High-Density Electronic PackagingNational Research Council Division on Engineering and Physical Sciences and others
Paperback
Publication Date: 31/01/1990

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$28.95
ISBN:
9780309042338
9780309042338
Category:
Electronics engineering
Format:
Paperback
Publication Date:
31-01-1990
Language:
English
Publisher:
National Academies Press
Country of origin:
United States
Pages:
156
Dimensions (mm):
279x216x0mm

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