Proceedings of 8th International Conference on Microelectronics, Electromagnetics and Telecommunications (ICMEET 2023)
Hardback
Publication Date: 24/07/2024
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- ISBN:
- 9789819707669
- 9789819707669
- Category:
- Circuits & components
- Format:
- Hardback
- Publication Date:
- 24-07-2024
- Publisher:
- Springer Verlag, Singapore
- Country of origin:
- Singapore
- Pages:
- 456
- Dimensions (mm):
- 235x155mm
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