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LCP for Microwave Packages and Modules

LCP for Microwave Packages and Modules

by Morgan J. ChenKunia Aihara and Anh-Vu H. Pham
Hardback
Publication Date: 21/06/2012

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A comprehensive overview of electrical design using Liquid Crystal Polymer (LCP), giving you everything you need to know to get up-to-speed on the subject. This text describes successful design and development techniques for high-performance microwave and millimeter-wave packages and modules in an organic platform. These were specifically developed to make the most of LCP's inert, hermetic, low-cost, high-frequency (DC to 110+ GHz) properties. First-hand accounts show you how to avoid various pitfalls during design and development. You'll get extensive electrical design details in areas of broadband circuit design for low-loss interconnects, couplers, splitters/combiners, baluns, phase shifters, time-delay units (TDU), power amplifier (PA) modules, receiver modules, phased-array antennas, flexible electronics, surface mounted packages, Microelectromechanical Systems (MEMS) and reliability. Ideal for engineers in the fields of RF, microwave, signal integrity, advanced packaging, material science, optical and biomedical engineering.
ISBN:
9781107003781
9781107003781
Category:
Electronics engineering
Format:
Hardback
Publication Date:
21-06-2012
Language:
English
Publisher:
Cambridge University Press
Country of origin:
United States
Dimensions (mm):
253x176x16mm
Weight:
0.68kg

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