Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
- ISBN:
- 9783319832098
- 9783319832098
-
Category:
- Circuits & components
- Format:
- Paperback
- Publication Date:
-
08-06-2018
- Publisher:
- Springer International Publishing AG
- Country of origin:
- Switzerland
- Edition:
- 2nd Edition
- Pages:
- 969
- Dimensions (mm):
- 235x155x49mm
- Weight:
- 1.35kg
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