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Search results for "John H. Lau"

Displaying results  1 to 19 of 19
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
by John H. Lau
Digital Delivery
Epub (Kobo), Epub (Adobe)
 
$251.99
Chiplet Design and Heterogeneous Integration Packaging
Chiplet Design and Heterogeneous Integration Packaging
by John H. Lau
Digital Delivery
Epub (Kobo), Epub (Adobe)
 
$197.99
Semiconductor Advanced Packaging
Semiconductor Advanced Packaging
by John H. Lau
Digital Delivery
Epub (Kobo), Epub (Adobe)
 
$179.99
Assembly and Reliability of Lead-Free Solder Joints
Assembly and Reliability of Lead-Free Solder Joints
by John H. Lau and Ning-Cheng Lee
Digital Delivery
Epub (Kobo), Epub (Adobe)
 
$161.99
Heterogeneous Integrations
Heterogeneous Integrations
by John H. Lau
Digital Delivery
Epub (Kobo), Epub (Adobe)
 
$224.99
Fan-Out Wafer-Level Packaging
Fan-Out Wafer-Level Packaging
by John H. Lau
Digital Delivery
Epub (Kobo), Epub (Adobe)
 
$152.99
3D IC Integration and Packaging
3D IC Integration and Packaging
by John H. Lau
Digital Delivery
Epub (Kobo), Epub (Adobe)
 
$298.99
Through-Silicon Vias for 3D Integration
Through-Silicon Vias for 3D Integration
by John H. Lau
Digital Delivery
Epub (Kobo), Epub (Adobe)
 
$221.99
Reliability of RoHS-Compliant 2D and 3D IC Interconnects
Reliability of RoHS-Compliant 2D and 3D IC Interconnects
by John H. Lau
Digital Delivery
Epub (Kobo), Epub (Adobe)
 
$199.99
Advanced MEMS Packaging
Advanced MEMS Packaging
by Yu Aibin, Cheng Kuo Lee, C. S. Premachandran and John H. Lau
Digital Delivery
Epub (Kobo), Epub (Adobe)
 
$244.99
Semiconductor Advanced Packaging
Semiconductor Advanced Packaging
by John H. Lau
In Stock with Supplier Aim to send in 1 - 2 weeks
Paperback
 
$179.00
Semiconductor Advanced Packaging
Semiconductor Advanced Packaging
by John H. Lau
In Stock with Supplier Aim to send in 1 - 2 weeks
Hardback
 
$249.00
Heterogeneous Integrations
Heterogeneous Integrations
by John H. Lau
In Stock with Supplier Aim to send in 1 - 2 weeks
Hardback
 
$229.00
Fan-Out Wafer-Level Packaging
Fan-Out Wafer-Level Packaging
by John H. Lau
In Stock with Supplier Aim to send in 1 - 2 weeks
Hardback
 
$219.00
Solder Joint Reliability
Solder Joint Reliability
by John H. Lau
In Stock with Supplier Aim to send in 1 - 2 weeks
Paperback
 
$329.00
Chip On Board
Chip On Board
by John H. Lau
In Stock with Supplier Aim to send in 1 - 2 weeks
Hardback
 
$329.00
Mechanics of Solder Alloy Interconnects
Mechanics of Solder Alloy Interconnects
by John H. Lau, Steven N. Burchett, Harold S. Morgan and Darrel R. Frear
In Stock with Supplier Aim to send in 1 - 2 weeks
Hardback
 
$329.00
Handbook Of Tape Automated Bonding
Handbook Of Tape Automated Bonding
by John H. Lau
In Stock with Supplier Aim to send in 1 - 2 weeks
Hardback
 
$329.00
Solder Joint Reliability
Solder Joint Reliability
by John H. Lau
In Stock with Supplier Aim to send in 1 - 2 weeks
Hardback
 
$329.00