Recent Trends in VLSI and Semiconductor Packaging

Recent Trends in VLSI and Semiconductor Packaging

by T. Vasudeva Reddy and K. Madhava Rao
Epub (Kobo), Epub (Adobe)
Publication Date: 06/05/2025

Share This eBook:

  $114.99

The International conference on Semiconductor Materials packaging, AI&ML, Reconfigurable VLSI architectures for IoT, future Communication Technologies (“SMART-2024”) aimed to provide a platform for researchers, academicians, industry experts, and practitioners to exchange ideas, present research findings, and discuss emerging trends and challenges in the specified fields. “SMART-2024” seeked to foster collaboration, innovation, and knowledge dissemination by bringing together experts and stakeholders from diverse backgrounds to address key issues and explore new research directions. The conference targeted a diverse audience including researchers, academicians, scientists, engineers, technologists, industry professionals, students, policymakers, and other stakeholders interested in VLSI, IoT, AI-ML, communication systems, semiconductor packaging, hetero architecture devices, and Nano materials.

ISBN:
9781040361641
9781040361641
Category:
Algorithms & data structures
Format:
Epub (Kobo), Epub (Adobe)
Publication Date:
06-05-2025
Language:
English
Publisher:
CRC Press

This item is delivered digitally

Reviews

Be the first to review Recent Trends in VLSI and Semiconductor Packaging.